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January 1998

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Subject:
Re: Solderability During Remelt
From:
"Case, Jeff" <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Tue, 6 Jan 1998 16:25:00 -0700
Content-Type:
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text/plain (13 lines) 
Krishna,
Looks like you better find some glue. It works well and is a fairly
simple solution.
Another possibility, but not fun, is to use a high temp solder on
the first part, that way the solder doesn't actually reflow during the
second part solder process.
Jeff
 ----------
From: Krishna Kalyan
To: [log in to unmask]
Subject: [TN] Solderability During Remelt

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