The SMC is pleased to announce the Technology Vision Analysis 2010 scheduled for
February 23-24, 1998 at Georgia Tech in Atlanta Georgia.
For those interested more information can be found at:
http://www.ipc.org/html/smcworkshop.htm
The Surface Mount Council (SMC) is a joint industry council made up of thirty plus
technical experts whose mission is to facilitate implementation issues in surface
mount and advanced electronic packaging technology. The council has been in
existence for ten years and is jointly sponsored by IPC, EIA, and SMTA. The council
has played a significant role in evaluating industry issues (such as solderability or
the lead ban) and develops white papers identifying issues to the industry and the
press regarding possible solutions, positions or potential paths forward.
The Workshop on Technology Vision Analysis 2010 is intended to provide a forum where
industry experts have a chance to review the predictions of the developers of
specific roadmaps. Information will be provided on similarities, as well as
disconnects between the various visions of the future. The material provided will
establish the focus for discussions and reactions to some of the variations and the
possible solutions
Why Look at Roadmaps
Technology roadmaps represent the vision of technologists involved in an industry
ready
to serve their customer base. They do not represent solutions; rather, they are the
best predictions that a group can make regarding the future needs of an industry.
They are essentially a wish-list based on technical opportunities to excel within the
industry domains.
At their September 1997 meeting, the council was looking to update the issues and
activities that they were
currently evaluating. During this discussion process, it was felt that there may be
significant value in having a group of individuals look at the various industry
roadmaps developed by SIA, IPC, NEMI, EDA OIDA, Hong Kong Productivity Council,
Packaging Research Center (PRC at Georgia Tech) as well as others and determine if
there is consistency or significant gaps between the portions of the technology
roadmaps in which there is overlap i.e. interconnections, assembly, components, etc..
The appropriate material would be reviewed and discussed with the discussion results
documented in a white paper. The Surface Mount Council hopes to use the associated
gaps and implementation issues as a basis for their future work (recommend industry
standard, additional white papers, paper sessions at trade shows, etc.), or feedback
to experts who developed the original roadmaps.
Feedback can be directed to my attention off of the TechNet listserv.
Thanks
Dave Bergman SMC Secretary
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