Hi Krishna
Apart from what Matthew recommends, if you do not want to go through
glue process and do not want to reflow base again and have to keep chips
on base as well at the same time ;
with convection you have an option of "chilled" base air feed with up to
a 25C temp. difference ,
that would hold you anything.
Tested & proven , original equipment or pending your oven perhaps a mod.
Without sparking commercials , write me back on my address, I'd have to
refer you to a specific solution .

See you                  Paul

>----------
>From:  Krishna Kalyan[SMTP:[log in to unmask]]
>Sent:  Wednesday, 7 January 1998 2:15
>To:    [log in to unmask]
>Subject:       [TN] Lead Soderability - second reflow
>
>Hello :
>
> Happy New Year to all of you.
>
> I am a process engineer trying to resolve the falling of a bottom side
>surface mount component during second pass of forced convection reflow.
>I am beginning to feel that the solderability of the component leads is
>getting reduced after the first pass of reflow and that is causing the
>part to fall. If any of you have had similar experiences, could you
>please share ? Your suggestions are welcome.
>
>Krishna Kalyan
>
>
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