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January 1998

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Subject:
From:
"Ziarek, Paul J" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 28 Jan 1998 15:37:57 -0600
Content-Type:
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     You might want to look at an article in the January 1995 (volume
     8,issue1) of The Journel of Surface Mount Technology,  Published by
     the Surface Mount Technology Association.  Titled " Through Hole
     Connector Soldreing With Solder Pasrt Reflow".


______________________________ Reply Separator ____________________________
_____
Subject: [TN] Solder Paste on PTH Boards. tickness=125 mils
Author:  [log in to unmask] at JOHNSON_CONTROLS
Date:    1/28/98 11:25 AM




     Have any of you experienced with solder paste on holes for assembly
     connectors both sides, on boards of 125 mils of thickness.
     Is there any spec about it? What is the minumum solder fillet
     accepted?
     do you have any recomendation on reflow Profiles? Special Stencil
     apertures? Special mesh?
     Mauricio Castro / Molex de Mexico
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