A good source for this type of information is your thickfilm material
supplier, so I would start there. In a previous life I was working with
materials specific to this topic.
  DuPont, Heraeus Cermalloy and MeTech are three companies I had direct and
successful dealings with, although there are many others. Good Luck!

At 02:38 PM 1/28/98 -0500, you wrote:
>Hi everyone,
>
>I was wondering if there anybody could share with me any information or
>suggestion related to via size, trace width and spacing optimization
>applicable to the thickfilm process. I mean techniques that will allow a
>design to beat 10 mil trace width and 10 mils spacing between lines.
>
>Some techniques may be useful (diffusion patterning, etching, mesh size and
>new pastes) for both (via and lines) but I do not have any information on
>that. If you do so, I will appreciate having that. If there is anything else
>to achieve that, I'm also interested.
>
>Thanks in advance
>
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Jeff L. Hempton        phone: (219) 429-7335   Fax: (219) 429-4688
Boardshop Manufacturing Engineer                        Mail Stop: 25-31
Raytheon Systems Company
1010 Production Road, Fort Wayne, IN 46808-4106
Email: [log in to unmask]

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