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January 1998

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Subject:
From:
Sherry Warner <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 28 Jan 1998 13:04:12 -0500
Content-Type:
text/plain
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text/plain (121 lines)
Bill,

I finally got a response from the training center for NASA that I knew had
the tool for making
elliptical funnel swages.  They bought the tool from Concord but as Howard
Feldmesser from APL
stated, the tool for the funnel swage was modified and in this case,
Concord made the modification
for them.

I haven't been able to find any criteria for the filling of swaged areas on
terminals.

Sherry Warner
SR. Engineer
GSFC/NASA
301/286-3940






>Bill,
>        Since we hand solder almost exclusively, I can't speak to the
>filling of
>the swaged area of terminals.  However, since half our assembly work is
>done to NASA standards, I can speak about "elliptical" swages.  We have
>been doing these for many years. As you discovered, the terminal
>manufacturers know nothing about these types of swages nor the tooling to
>perform them.  We simply took the standard funnel (or circular) swaging
>tool (as opposed to the roll swaging tool) and ground off part of the
>circle, leaving a long, thin swage.  The bottom of the terminal "flows"
>around the edges of the tool and leaves what is close to an ellipse. In
>ASCII, the tool looks something like:
>  /\
> /  \
> |   |
> |   |
> |   |
> \  /
>  \/
>
>[Sorry, that's the best I can draw it]
>The ground-off areas at the sides allow for solder to flow into the
>plated-through hole while the intact areas at the top and bottom ensure
>contact with the land.  Hope that helps.
>        Howard Feldmesser
>        Johns Hopkins University Applied Physics Laboratory
>
>At 08:01 AM 1/22/98 PST, you wrote:
>>to  Jan Satterfield and Sherry Warner:
>>
>>My experience with the soldering of terminals also seems to lead to a bit of
>>confusion for the solder criteria. When we wave solder terminals, we do not
>>have a problem with topside solder joints. The top side fillet is small, but
>>upon close examination, excellent wetting is present.
>>
>>The problem that I'm having, based upon someones interpretation, is that
>>solder is not allowed to fill the swaged area on the solder source side of
>>the board. So therefore, we tend to mask terminals and hand solder after
>>wavesoldering. The hand soldering is done from the solder source side
>>without problem. Do either of you have any reference criteria for the filing
>>of the swaged area ?
>>
>>Sherry, you speak to the NASA specs with respect to elliptical swaging. I
>>have spoken with a couple of terminal and swaging manufacturers (Cambion and
>>Concord) and they indicate that they don't know anything about elliptical
>>swaging. Have you ever bought elliptical tooling ?
>>If so, I am interested in your sources.
>>
>>Thanks,
>>
>>Bill Kasprzak
>>Moog Inc.
>>East Auruora, NY
>>[log in to unmask]
>>716-652-2000 ext 2507
>>
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