TECHNET Archives

January 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Mauricio Castro <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 28 Jan 1998 11:25:39 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines)
     Have any of you experienced with solder paste on holes for assembly
     connectors both sides, on boards of 125 mils of thickness.

     Is there any spec about it? What is the minumum solder fillet accepted?
     do you have any recomendation on reflow Profiles? Special Stencil
     apertures? Special mesh?

     Mauricio Castro / Molex de Mexico

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################


ATOM RSS1 RSS2