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January 1998

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Subject:
From:
Ron Hayashi <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Tue, 6 Jan 1998 09:50:02 -0800
Content-Type:
text/plain
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text/plain (22 lines)
Sam, are the dishdowns everywhere on the circuits, or are they located
where there are holes only.
There are a couple of things you may want to look at:
1) Check your developer, make sure the boards are getting a good rinse.
2) If the "dishdowns" are on the circuits only. Check to see if they are
located on both sides of the boards. If only on one side, is it the side that
the circuits would be horizontal in the plating tank? If so, check your
sparging system, you may be experiencing microbubbles attaching to the
circuits during pattern plating.

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