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January 1998

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Subject:
From:
"Chan, Marcelo" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 28 Jan 1998 08:49:27 -0500
Content-Type:
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text/plain (26 lines)
Based on the responses received, I may have been too vague.... My solder
paste vendor recommends approximately 30 seconds from the time the
solder becomes liquidus, 183 deg. C, to the peak temperature which in
most cases is from 210 to 235 deg. C.... In my case our peak temperature
is 215 deg. C.... My question is in regards to this 30 seconds...If I
know that I have wetting within 10 seconds or so, what are the
consequences to decreasing the reflow time from 30 to say 20 or even
10.... If intermettalics formation is an issue, please highlight how
thick should it be for BGA assemblies and methods to measure it....The
surface finish on this PWB is Im. Au...

Thanks
Marcelo

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