I would like to know what are the drawbacks of increasing or decreasing
the reflow time for BGA assemblies due to the actual thickness of the
PWB, and the thermal loading due to the number an type of
components...If the reflow time is 15 seconds rather than the solder
vendor recommended profile fo 30 seconds, how does that affect the
metalurgy of the joint and its reliability?  What if the reflow time is
45 seconds? And if I have to verify the intermettalics, how is that done
u sing X-sectioning and SEM...Is there a recommended approach for doing
this?

thanks,

Marcelo

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