We're experiencing a problem that could be described as similar to "dishdowns".

For now we're calling them "squigglies".

        The circuit has an indentation in the copper that appears to be an
area that did not plate copper while pattern plating. The areas are small
and have a somewhat circular shape with only the perimeter being devoid of
plated copper. The inside of this circular area did plate while pattern
plating. The base copper is still there.
        The circular shape and pattern could be something that leaked out of
the holes while they were racked at a previous process?

I'm hoping someone recognizes this condition and can help us out.

Thank you!

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