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January 1998

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Subject:
From:
JON MOORE <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 27 Jan 1998 08:58:15 -0500
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text/plain
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text/plain (103 lines)
The IPC limit for contamination is 10.07 ug / sq in NaCl equiv.    The 3 ug
limit is good for no-clean, but naturally the cleaner the better.

>>> Ken Patel <[log in to unmask]> 01/26/98 05:25pm >>>
Allan,
Can you or some one clarify... If the board is more than 3 mg. cl. sq. in.in
terns of contamination, PCBs are reject for no clean assembly process.
Is it
mentioned somewhere in IPC and also what is the limit for those PCBs
going
through regular water soluble paste and flux chemistry?

re,
ken patel

At 05:16 PM 1/23/98 -0500, Allan Kerr wrote:
>HASL does not leave a flat surface for the screen print operation, this
is
>especially true for very fine pinch boards.  Plus OSP is a "cleaner"
>process, MANY of the fab shops are not properly equipped to clean
>boards after the HASL operation.  If a fab shop can't clean a board to
<3
>mg. cl. sq. in.  they shouldn't sell boards that are to be used in a
no-clean
>process.  I'm sure CSL will add to this one.  This is a BIG issue to all of
us
>building high reliability products.
>
>>>> Sheila Smith <[log in to unmask]> 01/23/98 03:27pm >>>
>Hello,  Please refresh my memory ... what are the
>advantages/disadvantages
>of HASL over other processes?  Specifically, why would a Customer
>direct a
>PWB supplier that HASL is not to be used ...?
>
>Sheila Smith
>
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______________________________________________________
Ken Patel                       Phone:  (408) 490-6804
575 Cottonwood Dr.              Fax:    (408) 490-6859
Milpitas, CA 95035              Beeper: (888) 769-1808

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