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January 1998

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Subject:
From:
Motoyo Wajima <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 27 Jan 1998 14:41:48 +0900
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Mr. Engelmaier!
"I"stands for interstitial.
Regards,
Motoyo Wajima


Werner Engelmaier <[log in to unmask]>  $B$5$s$O=q$-$^$7$?!' (J
>Hi Jae-heun,
>I sure have not come across the acronyms "BVH" and "IVH" before; I take it
>that VH stands for via hole, B perhaps for blind, but what is "I"?
>I do not know of any reliability studies on blind vias. As a first step and
>until more definitive information is available, I would apply the information
>in IPC-D-279, "Design Guidelines for Reliable Surface Mount Technology Printed
>Board Assemblies", Appendix B, to blind vias. Considering the construction,
>the loading on blind vias during soldering processes will be significantly
>less than for PTVs, and therefore the minimum copper plating thickness is most
>likely defined by functional or manufacturing requirements, not reliability
>issues.
>
>Werner Engelmaier
>Engelmaier Associates, L.C.
>Electronic Packaging, Interconnection and Reliability Consulting
>7 Jasmine Run
>Ormond Beach, FL  32174  USA
>Phone: 904-437-8747, Fax: 904-437-8737
>E-mail: [log in to unmask]
>
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***********************************************
Motoyo Wajima
General Purpose Computer Division,Hitachi,Ltd.
1 Horiyamashita
Hadano-shi,Kanagawa-ken,259-13 Japan
E-mail:[log in to unmask]
Fax:+81-463-88-2935
***********************************************

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