Tim,
        There are a number of ways to place thermocouples in the center most
leads/balls of a BGA.  This is of course dependant on the component and
board configurations.  If you have access to one side of the board and the
BGA pitch isn't too fine, getting a thermocouple into a ball on the under
side of the BGA isn't too hard.  If you want to know more, contact me
off-line.

John Guy
ACI / EMPF
714 N. Senate Ave.
Indianapolis, IN 46202-3112
voice:  (317) 655-EMPF ext.130
fax:    (317) 655-3699
e-mail:         [log in to unmask]

-----Original Message-----
From:   Stammely, Tim [SMTP:[log in to unmask]]
Sent:   Monday, January 26, 1998 4:56 PM
To:     [log in to unmask]
Subject:        [TN] BGA reflow oven profile?

Where should I place my thermocouples to determine the best oven profile
for assemblies having BGAs since their leads aren't reachable, and how
should I attach them?

Thanks

Tim Stammely
Manufacturing Services & Integration (MSI)

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