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January 1998

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Subject:
From:
Krishna Kalyan <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Tue, 6 Jan 1998 07:15:45 PST
Content-Type:
text/plain
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text/plain (29 lines)
Hello :

 Happy New Year to all of you.

 I am a process engineer trying to resolve the falling of a bottom side
surface mount component during second pass of forced convection reflow.
I am beginning to feel that the solderability of the component leads is
getting reduced after the first pass of reflow and that is causing the
part to fall. If any of you have had similar experiences, could you
please share ? Your suggestions are welcome.

Krishna Kalyan


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