Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Sun, 25 Jan 1998 23:59:30 +0800 |
Content-Type: | text/plain |
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Hi Technetters,
Have anyone seen a detached compoment, especially, a QFP, that has been
reflow and detached later. When observaing the solder formation on the pad,
it showed that a good wetted joint is formaed, but I couldn't understand
why it dropped/detacted during transportation. Could someone help to
comment why.
Thks in Advance.
Poh
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