All,
     
     We are a small engineering and manufacturing company just getting into 
     surface mount assembly.  We have been almost exclusively through hole but 
     with the elimination of many through hole parts, we find it necessary to 
     move on.  Additionally, most of our manufacturing contracts in the past 
     were older 'build to print' jobs based upon old designs for our military 
     customers.
     Soon, both manufacturing and engineering representatives will meet to 
     discuss manufacturing's design requirements.  Because we have had so little 
     experience with surface mount assembly, we really don't know what to ask 
     for from a design for manufacturing standpoint.
     I would be interested in any design specifications or really any reading 
     material that could point us in the right direction (i.e. pad geometry, 
     component orientation, etc.) as well as manufacturing 
     specifications/guidelines (i.e. stencil printing, solder reflow, etc.).  We 
     are currently reviewing IPC-S-816, D-279, and SM-782.
     
     Thank you all in advance of your support.
     
     Steve McBride
     Manufacturing Engineer
     Frontier Electronic Systems Corp.
     
     (www.FEI-CORP.com)

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