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January 1998

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Subject:
From:
"Chan, Marcelo" <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Thu, 22 Jan 1998 10:05:24 -0500
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The so called 'solder suckers' from what I have seen work well if you
are able to pre-heat the entire array to temperatures around 120deg. C
and locally on the pads above the reflow temp....check AirVac (203
888-9900) and if you have more money, check SRT (978)392-0633 for their
offerings.... I would be curious to know what you find out regarding the
Cu block...I have never heard of it......... The AirVac 'solder sucker'
has been able to remove solder from our pads for uBGA and 8 mil pads for
flip chip but you need to have their machine or equivalent to do it.....

Marcelo Chan
Harris Corp., FL
> -----Original Message-----
> From: Charles Elliott [SMTP:[log in to unmask]]
> Sent: Thursday, January 22, 1998 8:53 AM
> To:   [log in to unmask]
> Subject:      [TN] BGA Rework Site Dressing
>
> Subject: BGA Rework Site Dressing
> 1998.01.228:42 AM
>
> Hello Technetters!
>
> I am interested in different methods of site dressing for BGA rework.
>
> Using a solder wick going in a "pad by pad" pattern or one row at a
> time seems
> to be predominant method.  However, coplanarity of pads seems quite
> operator
> dependent and there is also a risk of pushing some solder down
> "dogbone vias"
> (for boards without button printing / capping / tenting).
>
> Have you had better success with "solder suckers" ?
> Do you know of suppliers for big solder wicks which can cover entire
> site ?
> Have you used something called a "Copper block" (has been used for
> flip chip)
> and where could I purchase some ?
>
> How is coplanarity with above methods ?
>
> Your input is always appreciated.
>
> Regards,
>
> Charles Elliott
> NPI Process Engineering
> Newbridge Networks Corp.
> [log in to unmask]
>
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