Subject: BGA Rework Site Dressing                         1998.01.228:42 AM

Hello Technetters!

I am interested in different methods of site dressing for BGA rework.

Using a solder wick going in a "pad by pad" pattern or one row at a time seems
to be predominant method.  However, coplanarity of pads seems quite operator
dependent and there is also a risk of pushing some solder down "dogbone vias"
(for boards without button printing / capping / tenting).

Have you had better success with "solder suckers" ?
Do you know of suppliers for big solder wicks which can cover entire site ?
Have you used something called a "Copper block" (has been used for flip chip)
and where could I purchase some ?

How is coplanarity with above methods ?

Your input is always appreciated.

Regards,

Charles Elliott
NPI Process Engineering
Newbridge Networks Corp.
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