to  Jan Satterfield and Sherry Warner:

My experience with the soldering of terminals also seems to lead to a bit of
confusion for the solder criteria. When we wave solder terminals, we do not
have a problem with topside solder joints. The top side fillet is small, but
upon close examination, excellent wetting is present.

The problem that I'm having, based upon someones interpretation, is that
solder is not allowed to fill the swaged area on the solder source side of
the board. So therefore, we tend to mask terminals and hand solder after
wavesoldering. The hand soldering is done from the solder source side
without problem. Do either of you have any reference criteria for the filing
of the swaged area ?

Sherry, you speak to the NASA specs with respect to elliptical swaging. I
have spoken with a couple of terminal and swaging manufacturers (Cambion and
Concord) and they indicate that they don't know anything about elliptical
swaging. Have you ever bought elliptical tooling ?
If so, I am interested in your sources.

Thanks,

Bill Kasprzak
Moog Inc.
East Auruora, NY
[log in to unmask]
716-652-2000 ext 2507

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