All,

We have a new board coming up that will be 6.3" x 9.3" with 30-40 fine pitch
(20 mil) per side (mostly PQFP, couple TSSOP).  Board will be 6-8 layers,
.062 thick,
~400-500 total components, 2 compliant pin connectors.

Can I ask any of you who are processing boards with similar density what
your reflow process
is?  Will I have problems with a straight 2-sided reflow process or should I
look at
fixturing to keep side 1 from reflowing when side 2 is reflowed?  We have a
Conceptronics
HVN-102 (7-zone) reflow oven.  We do not have glue-dispensing capability at
this time.

Next generation of this product will have equal number of BGA on both sides,
what do
I need to be concerned about other than the rework process?  Thanks for any
inputs...

Steve


----
Steve Schrader
VP Manufacturing
Patton Electronics Co.
http://www.patton.com

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