A word of caution if you're assembling moisture sensitive devices. I
think that exposure ratings are based on 30 deg. C and 60% rh. If you
operate above this, you'll have to consider shortening exposure limits.
Yves Trudell
Quality System Engineering
Nortel, Wireless Networks Calgary
>----------
>From: David Girard[SMTP:[log in to unmask]]
>Sent: Tuesday, January 20, 1998 10:43 AM
>To: [log in to unmask]
>Subject: Re: [TN] Assembly Floor Humidity Requirements
>
>ANSI/J-STD-001 recommends between 18 to 30C and 30% to 70% R.H. I
>personally think that anything over 25C is too warm to work.
>
>David Girard, CQE, NCE
>Product Assurance Engineer
>
>Disclaimer:
>The previous statements are only my opinions and may or may not be that
>of my employer, friends, relatives, acquaintances, anyone I have ever
>met or anyone my friends, relatives, or acquaintances have ever met.
>
>> ----------
>> From: Juanita Zeinstra[SMTP:[log in to unmask]]
>> Sent: Friday, January 16, 1998 13:30
>> To: [log in to unmask]
>> Subject: [TN] Assembly Floor Humidity Requirements
>>
>> We are located in Grand Rapids Michigan. We are moving across
>> town to
>> a new building which is being renovated to suit our needs. With
>> a
>> tight budget getting tighter, there is a somewhat political and
>> emotional contest in the making.
>>
>> By title our assembly facility will be called the "Engineering
>> Manufacturing Development Center (EMDC)". Engineering activity
>> is
>> located in Grand Rapids, Mi. while production manufacturing will
>> be
>> located in Clearwater, Fla. The EMDC will have process
>> development,
>> low volume and transition responsibilities.
>>
>> We assemble primarily SMT boards but there is some thru-hole and
>> mixed
>> technology as well. Processing in the EMDC includes wave, vapor
>> phase, and hand soldering. IR, convection ovens or even new
>> technolgy
>> soldering may be added later, as well. Our boards are primarily
>> rigid
>> polyimide boards but flex and rigid-flex boards are processed
>> occasionally. Thermount boards are being considered for the
>> future.
>> Cu-Invar-Cu and Cu-Mo-Cu stabilizing cores are frequently
>> employed for
>> CTE stabilization.
>>
>> We will be using more and more plastic and commercial parts and
>> less
>> of the ceramic and military grade parts, as is the industry
>> trend. It
>> also goes without saying that expect to track industry trends in
>> technology, components and processing.
>>
>> We are in the business for the long term. We started our
>> operations
>> in GR in the early 1950's and we will have a 20 year lease on our
>> new
>> facility. Our business niche is high technology commercial and
>> military avionics. Our facility size is almost 900,000 Sq.Ft.
>> and the
>> EMDC and circuit card assembly areas could be as large as 15K-25K
>> Sq.
>> Ft. in size.
>>
>> With that as background, the question is as follows;
>>
>> What temperature / humidity requirements would you recommend for
>> the EMDC and assembly areas of our new facility?
>>
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