ANSI/J-STD-001 recommends between 18 to 30C and 30% to 70% R.H. I
personally think that anything over 25C is too warm to work.
David Girard, CQE, NCE
Product Assurance Engineer
Disclaimer:
The previous statements are only my opinions and may or may not be that
of my employer, friends, relatives, acquaintances, anyone I have ever
met or anyone my friends, relatives, or acquaintances have ever met.
> ----------
> From: Juanita Zeinstra[SMTP:[log in to unmask]]
> Sent: Friday, January 16, 1998 13:30
> To: [log in to unmask]
> Subject: [TN] Assembly Floor Humidity Requirements
>
> We are located in Grand Rapids Michigan. We are moving across
> town to
> a new building which is being renovated to suit our needs. With
> a
> tight budget getting tighter, there is a somewhat political and
> emotional contest in the making.
>
> By title our assembly facility will be called the "Engineering
> Manufacturing Development Center (EMDC)". Engineering activity
> is
> located in Grand Rapids, Mi. while production manufacturing will
> be
> located in Clearwater, Fla. The EMDC will have process
> development,
> low volume and transition responsibilities.
>
> We assemble primarily SMT boards but there is some thru-hole and
> mixed
> technology as well. Processing in the EMDC includes wave, vapor
> phase, and hand soldering. IR, convection ovens or even new
> technolgy
> soldering may be added later, as well. Our boards are primarily
> rigid
> polyimide boards but flex and rigid-flex boards are processed
> occasionally. Thermount boards are being considered for the
> future.
> Cu-Invar-Cu and Cu-Mo-Cu stabilizing cores are frequently
> employed for
> CTE stabilization.
>
> We will be using more and more plastic and commercial parts and
> less
> of the ceramic and military grade parts, as is the industry
> trend. It
> also goes without saying that expect to track industry trends in
> technology, components and processing.
>
> We are in the business for the long term. We started our
> operations
> in GR in the early 1950's and we will have a 20 year lease on our
> new
> facility. Our business niche is high technology commercial and
> military avionics. Our facility size is almost 900,000 Sq.Ft.
> and the
> EMDC and circuit card assembly areas could be as large as 15K-25K
> Sq.
> Ft. in size.
>
> With that as background, the question is as follows;
>
> What temperature / humidity requirements would you recommend for
> the EMDC and assembly areas of our new facility?
>
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