TECHNET Archives

January 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet Mail Forum.
Date:
Tue, 20 Jan 1998 09:40:39 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines)
Dear IPC experts:
I am looking for information regarding J- leaded component ( SMD switches )
 heights  variation due to reflow soldering.  We are using 6 mils stencil.
The maximum allowed solder paste thickness is 8 mils.
What could be the maximum solder thickness under the component's lead after
reflow ?

Any help would be greatly appreciated.

Stella Neyman
ASD, Eaton Corp.
248-608-7289

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################

ATOM RSS1 RSS2