Dear IPC experts:
I am looking for information regarding J- leaded component ( SMD switches )
heights variation due to reflow soldering. We are using 6 mils stencil.
The maximum allowed solder paste thickness is 8 mils.
What could be the maximum solder thickness under the component's lead after
reflow ?
Any help would be greatly appreciated.
Stella Neyman
ASD, Eaton Corp.
248-608-7289
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