Hi David,

I don't have any figures but this is common practice with all the
companies I work with.
But then, I MAY have a different definition of a dead pad.
I mean that the pad is dead on all inner layers that it does not have
a connecting wire on.
On outer layers, I've never seen it but if a pad is unconnected in an
inner layer, it's safe to remove it.

For plane layers, it's slightly different since it's either a matter of
connection or no connection where the 'no connection' is a form
of clearance rule.

However, you would not like to remove the pad completely -just
decrease the size. That will ease routing on that layer if your cad tool
supports this dynamically.
You will need a small pad to prevent  plating chemicals to go
into the lamination between the layers. -How big of a risk it is
to get problems with plating chemicals if you do remove the pad
completely, I don't now.

Regards

Per Viklund
Dansk Data Elektronik AS
mailto:[log in to unmask]
http://www.dde.dk/eda/



David Backen wrote:
>
> We are looking for data, papers or personal experience with regards to
> dead pad removal (both signal and plane layers) and the impact on hole
> wall reliability.
>
> Board type: 4 - 14 layers,  20 - 100 mils thick, FR-4 material and other
> material types if available.
>
> I appreciate any information you may have.
>
> Regards,
> Dave Backen
> [log in to unmask]

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