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January 1998

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Sat, 17 Jan 1998 14:35:01 -0600
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     Robert,

     Burr is when it gets really freaking cold on a flat Kansas/Oklahoma
     oil field; NOT

     Seriously:

     It is very common to have residual material (X, Y and Z) on a scored
     fab.  Mechanical or manual depanelization does not matter on the
     amount of residual or burr material as you note it (yeah, you'll have
     some fibers, but not enough to skew your dimension check).  Figure out
     the angle at which the Fab house is scoring the material, this helps
     and is sometimes standard.  Modify you Mechanical Drawings to reflect
     new tolerances.  For our fabs, I have defined +.000-.005 and
     +.005-.000 on either side of the board.  These dimensions are very,
     very critical considering they go into Type I and Type II Smart cards
     (PCMCIAs).  I am limited on the case dimensions.  I take into
     consideration the residual (X or Y and not Z residual) following
     depanelization resulting from the fab score.  The design was also
     moodified to ensure that components did not conflict with tight
     tolerances and mechanical depanelizing.

     Call me if you have other questions.

     John Gulley
     Inet Inc.
     972.578.3928






______________________________ Reply Separator _________________________________
Subject: [TN] BURR
Author:  Padmanabha Anandapuram Halappa <[log in to unmask]> at Internet
Date:    1/16/98 12:39 PM


     Good day Folks,

     We face dimension problem after depanellise the v-scoring board. The
     board's thickness is 0.062" and the v-scoring remaining thickness is
     0.015". After depanellise, the board dimension is found to increase by
     0.01".

     According to the fab. house, this is caused by the burr (protrusion)
     after depanelling the board.

     Is there any standard spec. for the burr after depanelling the
     v-scoring board? What is the general dimension tolerance used in
     design the board with v-scoring?


     Thanks


     Robert

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