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January 1998

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Subject:
From:
Charles Barker <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 16 Jan 1998 14:47:57 -0600
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Charles Barker@I-O INC
01/16/98 02:47 PM

Ron, a few questions come to mind;

1. How wide are the openings in your stencils?
2. What is the ratio of the stencil opening to the thickness of the
stencil?
3. Are you experiencing solder starvation on certain leads?
4. If so, how often and how are you cleaning the stencils?
5. Are these parts humidity sensitive? Is the moisture absorption being
controlled?
6. What is the characterization of the defects? Lifted leads? Non-wetted
leads? Non-wetted pads? Insufficient solder?
7. Can you get a measurement of the thickness and/or volume of solder paste
being deposited? What is it?
8. What durometer squeegee material?

Good luck, Charlie B.




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Subject:  [TN] Poor Soldering of 240 pin PQFPs more info




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