We are located in Grand Rapids Michigan.  We are moving across town to
     a new building which is being renovated to suit our needs.  With a
     tight budget getting tighter, there is a somewhat political and
     emotional contest in the making.

     By title our assembly facility will be called the "Engineering
     Manufacturing Development Center (EMDC)".  Engineering activity is
     located in Grand Rapids, Mi. while production manufacturing will be
     located in Clearwater, Fla.  The EMDC will have process development,
     low volume and transition responsibilities.

     We assemble primarily SMT boards but there is some thru-hole and mixed
     technology as well.  Processing in the EMDC includes wave, vapor
     phase, and hand soldering.  IR, convection ovens or even new technolgy
     soldering may be added later, as well.  Our boards are primarily rigid
     polyimide boards but flex and rigid-flex boards are processed
     occasionally.  Thermount boards are being considered for the future.
     Cu-Invar-Cu and Cu-Mo-Cu stabilizing cores are frequently employed for
     CTE stabilization.

     We will be using more and more plastic and commercial parts and less
     of the ceramic and military grade parts, as is the industry trend.  It
     also goes without saying that expect to track industry trends in
     technology, components and processing.

     We are in the business for the long term.  We started our operations
     in GR in the early 1950's and we will have a 20 year lease on our new
     facility.  Our business niche is high technology commercial and
     military avionics.  Our facility size is almost 900,000 Sq.Ft. and the
     EMDC and circuit card assembly areas could be as large as 15K-25K Sq.
     Ft. in size.

     With that as background, the question is as follows;

     What temperature / humidity requirements would you recommend for
     the EMDC and assembly areas of our new facility?

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################