Reduce the amount of solder stenciled on the pads prior to placement.
Typically a 35% reduction in the stencil opening is enough to fix this type
of peoble. Be sure to keep solder paste under the terminations to insure
paste/flux contact to that metalization prior to reflow.

Regards,


John Maxwell

>     We have been experiencing problems with tombstoning of 1210 caps.  I
>     have not been able to find any information about parts this large
>     tombstoning.  Is there any way to fix this problem while we are
>     waiting for a design change to the pad layout?
>
>     Any help on this subject will be greatly appreciated.
>
>     Sean Gearin
>     [log in to unmask]
>

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