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January 1998

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Subject:
From:
Paul Klasek <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 16 Jan 1998 09:06:20 +1100
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Good Day Folks

Would any of you work on high speed solder paste dispensing ;
I feel lonely and would like to have few pen pals .
Namely issues like dual needle on passive pads, oval design pads paste
utilisation, surface x paste adhesions , AlphaLevel, etc.

Thanks a lot ahead .                Paul

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