Dear All,
Can you help?
I've had a request from a customer via our sales engineer. The customer
will shortly have the capability to assemble components to both sides of
panels using QFPs with 0.016" pitch and BGAs. They have asked us if we
know of any problems with these ideas. We know very little about BGAs (
except that it stands for ball grid array ) and judging by the
correspondence on the Technet recently there are lots of things that can
go wrong, can anyone suggest any articles, magazines etc. that we can
recommend to this customer?
I will suggested to this customer that they join the Technet - they would
find it useful, we certainly do.
Keep up the good work and thanks in anticipation!

Regards
Leon

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