Richard MacCutcheon wrote:
>
> ======== Original Message ========
> Friends over the world,
>
> Is there any problem spelling out "ALL GROUND/POWER PLANE CONNECTIONS SHOULD
> HAVE THERMAL RELIEF " on my fab drawings.
>
> Please provide me pros and cons before I make a call.
> Your help is greatly appreciated.
>
> re,
> ken patel
>
> ______________________________________________________
> Ken Patel                       Phone:  (408) 490-6804
> 575 Cottonwood Dr.              Fax:    (408) 490-6859
> Milpitas, CA 95035              Beeper: (888) 769-1808
>
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> ======== Fwd by: Richard MacCu ========
> I have seen this called out in design criteria when outsourcing designs and
> would say that on a fab drawing it would be acceptable.  I would also
> suggest that the word "should" be changed to "shall" to remove doubt.
>
> Richard MacCutcheon
>
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PLEASE add them.  We are a contract manufacturer specializing in
Prototypes and Rework/Repair and you wouldn't believe the difficulty we
have in trying to convince our customers to alwys use thermal reliefs.
Two major points:  You get much better solder connections and the PCBA's
are much easier to rework.  In some of the very dense PCBA's we
assemble, you would be surprised how long it can take to hand solder or
desolder a connector that doesn't have thermal reliefs, especially
without damaging the PC Board. Thanks and please encourage other board
designers to add  a global statement about thermal reliefs on all
drawings.

Ed Valenine
Protronics, inc.
Knightdale, NC
Phone: (919)217-0007, Fax: (919) 217-0050
e-mail: [log in to unmask] or [log in to unmask]

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