Presently we have an automatic vertical pattern plating line (acid copper and
tin resist).  Original manufacturer- Napco. Cathode sizing up to 36" x 72".
Plating thickness variation from panel to panel has become an issue and we
are looking for ways to improve.  We presently use top anode shields,
incorporate plating thieves on panel designs to help improve distribution.
Has anyone had experience retrofitting solution impingement equipment,
sparger systems, floating shields on a similar process line for the copper
buildup process?  If so, were results positive, was cycle time reduced?
Thanks.

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