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January 1998

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Subject:
From:
Kathy Palumbo <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 14 Jan 1998 12:12:10 -0800
Content-Type:
text/plain
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text/plain (60 lines)
Absolutely not.  In fact I've been told by some board houses that if you
don't spell everything out they will do just about anything they want,
even if you put on your fab drawing to build to IPC spec's.

Just a thought.

Thanks,
Kathy Palumbo

> ----------
> From:         Ken Patel[SMTP:[log in to unmask]]
> Sent:         Wednesday, January 14, 1998 11:12 AM
> To:   [log in to unmask]
> Subject:      [TN] Thermal Relief at Ground/Power Plane Connections
>
> Friends over the world,
>
> Is there any problem spelling out "ALL GROUND/POWER PLANE CONNECTIONS
> SHOULD
> HAVE THERMAL RELIEF " on my fab drawings.
>
> Please provide me pros and cons before I make a call.
> Your help is greatly appreciated.
>
> re,
> ken patel
>
> ______________________________________________________
> Ken Patel                       Phone:  (408) 490-6804
> 575 Cottonwood Dr.              Fax:    (408) 490-6859
> Milpitas, CA 95035              Beeper: (888) 769-1808
>
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