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January 1998

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Subject:
From:
David D Hillman <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 14 Jan 1998 12:05:51 -0600
Content-Type:
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Hi DT - the IPC's "A Summit On PWB Surface Finishes and Solderability"
conference proceedings contains some good information on OSP technology.
Give the IPC a call to get a copy.

Dave Hillman
Rockwell Collins
[log in to unmask]




[log in to unmask] on 01/13/98 08:49:26 AM

Please respond to [log in to unmask]; Please respond to [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: David D Hillman/CedarRapids/Collins/Rockwell)
Subject:  [TN] OSP




TechNet:
Can anyone point me to some literature or website that gives an overview of
the pros/cons of OSP??
Tks......DT
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