TECHNET Archives

January 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Plating Adhesions and Poiso
From:
David D Hillman <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Mon, 5 Jan 1998 10:40:54 -0600
Content-Type:
multipart/mixed
Parts/Attachments:
text/plain (861 bytes) , Message Body (2258 bytes) 



Hi TechNet - I can shed some light on your poisoning of a wave solder bath
by brass pins question! Zinc will cause you wave solder bath to excessively
dross and copper will cause excess solder bridging - take a look at
paragraph 4.4.5, page 108 (Zn info) and paragraph 4.4.3, page 106 (Cu info)
of Klein Wassink's book (ISBN 0-901150-14-2). However, you would have to be
exposing your solder wave bath to quite a bit of brass surface area to
"poison" your wave solder bath. You can have a chemical analysis of your
solder bath to understand just what impurities are present too.  Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]





[log in to unmask] on 12/23/97 08:40:46 AM

Please respond to [log in to unmask]; Please respond to [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: David D Hillman/CedarRapids/Collins/Rockwell)
Subject:  [TN] Plating Adhesions and Poiso

ATOM RSS1 RSS2