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January 1998

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Date:
Wed, 14 Jan 1998 06:24:17 -0500
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Hi Kenny,
For starters, you must keep in mind that MIL-STD-2000A is a document that
was written with common sense in mind and attempted to remove ambiguous
"How to" requirements that can open up a myriad of debates.  Although I am
no longer in a position within the military to directly provide an
interpretation of requirements, the following is the intent (my perspective
as a former Navy Category A) of the requirements affecting your situation:
     Your gold removal solder pot is used only to remove gold and prepare
the lead surface for a subsequent soldering operation.
     This process (I'll assume) is also used to ensure the parts are
solderable vice performing solderability testing as part of your material
control and storage procedures.
     Solder purity requirements only apply to solder pots (static or
dynamic) that are used to create the desired solder connection (joint).
     NOTE:  Although, not a requirement, I do suggest that you develop a
preventative maintenance plan for this gold dipping pot that can
demonstrate the control of the solder purity over time and usage.  This
purity level can be determined by you based upon your solder connection
quality which will be directly resultant of the ability to remove the gold
and create a readily solderable surface. You most likely have historical
analysis on the solder purity.  Use this historical data to establish your
maintenance frequency and action.  Dependent on the size of your solder
pot, it may be more economical to dump the pot than to periodically check
the purity.  If you end up having a purity problem with the tinning pot, it
will show up in the purity analysis on your wave solder pot or as poorly
wetted solder joints on the gold plated leads (both instances should be
avoided for its already too late).

Hopefully this answers your question.

Steve Sauer
Electronics Manufacturing Engineering Specialist
Hill-Rom
Batesville, IN 47006
812-934-1655

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