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Reply To: | TechNet Mail Forum. |
Date: | Mon, 5 Jan 1998 08:36:09 -0600 |
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Hi Gerard!
I recommend you get a copy of the following paper (although I don't think
its the one you are looking for):
"A Model For Solderability Degradation" by Dr. Chris Hunt, SMI Conference
Proceedings 1996, Volume II, Pages 650-655".
The paper does a very good job of covering the basics of intermetallic
growth in a simple manner. Good Luck.
Dave Hillman
Rockwell Collins
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[log in to unmask] on 12/29/97 02:11:06 PM
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Subject: [TN] CuSn Intermetallic growth
I seem to recall that a study was done a while back regarding the rate of
growth of Copper tin intermetallics each time a panel was subjected to the
HASL process , including reworks.
Any information on said subject?
Regards.
Gerard O'Brien.
Photocircuits Corporation
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