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January 1998

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Subject:
From:
David D Hillman <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Mon, 5 Jan 1998 08:36:09 -0600
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Hi Gerard!

I recommend you get a copy of the following paper (although I don't think
its the one you are looking for):

"A Model For Solderability Degradation" by Dr. Chris Hunt, SMI Conference
Proceedings 1996, Volume II, Pages 650-655".

The paper does a very good job of covering the basics of intermetallic
growth in a simple manner. Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]





[log in to unmask] on 12/29/97 02:11:06 PM

Please respond to [log in to unmask]; Please respond to
      [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: David D Hillman/CedarRapids/Collins/Rockwell)
Subject:  [TN] CuSn Intermetallic growth




I seem to recall that a study was done a while back regarding the rate of
growth of Copper tin intermetallics each time a panel was subjected to the
HASL process , including reworks.
Any information on said subject?
Regards.
Gerard O'Brien.
Photocircuits Corporation
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