We still have some Mil-Std-2000A contracts and a question has been asked
about how often, and for what levels of contamination, does the gold tinning
pot need to be tested.  Since it is used to basically remove gold from
component leads prior to solder dipping does it need to meat the same
requirements of a dipping (pre tinning) pot.  If it doesn't then what would
the requirements be so that you don't start contaminating your dipping pot
with gold drag out?

Thanks in advance for all responses.
KennyB

Ken Bloomquist
Sr. Principal Process Eng.
PRIMEX Aerospace Company
[log in to unmask]
(425) 881-8990 ext. 6645

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