Subject: | |
From: | |
Reply To: | TechNet Mail Forum. |
Date: | Tue, 13 Jan 1998 15:36:26 GMT |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hi all,
I'm looking for help in sourcing an adhesive tape, suitable for wafer
backgrinding, that can withstand a subsequent bake to 120C, before
being removed from the wafer.
You can reply direct to me or the mail group, as you wish.
regards
Olly
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################
|
|
|