I don't think so.  I believe the type of stencil, and the material the
stencil is made of will play a big factor in speed of release.
Smoothness and shape of the apperatures would definitely affect the
speed of the solder paste being pushed through the apperatures.  If you
are using an ultra pure nickel stencil which has been laser cut vs a
chemical etch stencil the solder paste will release much quicker with
the ultra pure nickel stencil.  Also, since nickel has a much lower
surface tension than stainless steel you will get faster release as
well.

Just a thought.

Thanks,
Kathy Palumbo

> ----------
> From:         tana[SMTP:[log in to unmask]]
> Sent:         Monday, January 12, 1998 2:07 AM
> To:   [log in to unmask]
> Subject:      [TN] Paste velocity thru apertures (approximate value)
>
> Hi Technetters,
>
> Would it be fair to say that during stencil printing, the speed at
> which the paste goes through the apertures is equal(?) to the speed
> of the squeegee?
>
> Tennyson
> Tennyson Nguty, AeroMech Department, Newton Building, Salford
> University
> Manchester M5 4WT, UK. Tel: 0161-295 5951/4696, Fax: 0161-295
> 5575/5108
>
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