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January 1998

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Subject:
From:
Matthew Park <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Mon, 12 Jan 1998 10:23:46 -0800
Content-Type:
text/plain
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text/plain (64 lines)
Tennyon,

You have posted a very interesting question in the technet.  I
never thought it in this aspect for last 10 years working with
solderpaste.  Whenever solderpaste skips or semi-deposition
of paste ocurr, first thing that I advise my operators/tech to
check smooth'n consistent rolling effect of solderpaste being
printed.  The travel speed of squeegee is always greater than
the angular speed of the circumference of roll.  Therefore I
believe the speed at which  paste goes thru stencil apertures
is equal to the Y-vector of that angular speed.  The Y-vector
is depended upon the angle of squeegee attack.

Just my non-scientific opinion, interest to know the
conclusion of your study if this is what you are doing.

regards
Matthew
Automation Engineer
NII Norsat Internatioinal Inc.

>>> tana <[log in to unmask]> January 12,
1998  2:07 am >>>
Hi Technetters,

Would it be fair to say that during stencil printing, the speed
at
which the paste goes through the apertures is equal(?) to the
speed
of the squeegee?

Tennyson
Tennyson Nguty, AeroMech Department, Newton Building,
Salford University
Manchester M5 4WT, UK. Tel: 0161-295 5951/4696, Fax:
0161-295 5575/5108

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