Put solder mask on the via pads (or plug them from the solder side).
     They will never fill, so cannot short. Of course, not all customers
     will allow this.

     If you can do this, you don't have to worry about design limits or
     change process settings. It's much easier to design this out than to
     pull other process parameters out of optimization or unnecessarily
     constrain the design staff.

     Aric Parr


______________________________ Reply Separator _________________________________
Subject: [TN] Assy:Min distance between vias in wavesoldering
Author:  Johannes Sivula <[log in to unmask]> at INTERNET