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January 1998

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Subject:
From:
Johannes Sivula <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Mon, 12 Jan 1998 16:52:08 +0200
Content-Type:
text/plain
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text/plain (28 lines)
Hi,

Please comment:

We have a problem in our wavesoldering process; Vias   are too close to
each other,  and   solderbridges occur.
The width of soldermask between vias is only 0.2 mm,   ( 0.008" ).  Hole
size is   0.4---0.6 mm ( 0.016"---0.024" )

Sometimes it is a must to design vias in parallel with the solder wave.

What is the minimum width of soldermask between vias so that bridges can
be avoided ?

Brs, Johannes

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