In a message dated 98-01-09 11:15:12 EST, you write:

>  Alan,
>
>  Someone may have already replied with this information and I just missed
it, but
>  from an assembly point of view, the biggest benefit of the immersion gold
over the HASL
>  is the flatness achieved on the pads on fine pitch surface mount parts.
This is critical
>  for 20 mil and below fine pitch assembly yields.

Another significant advantage of gold over HASL is cleanliness.  HASL is a
dirty process that often leaves high levels of halide on a board.  Halides are
death to high impedance devices.  Gold is generally a very clean process,
assuming you have good rinsing after the acid plating processes.

Doug Pauls
CSL

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################