Matthew,

Please send a copy my way also, sir. My fax is (619) 661-4424.

Thank you in advance.

Richard Hamilton
Clemar Mfg. / Rain Bird
[log in to unmask]

> -----Original Message-----
> From: Matthew Park [SMTP:[log in to unmask]]
> Sent: Wednesday, January 07, 1998 8:37 AM
> To:   [log in to unmask]
> Subject:      [TN] Stencil Aperture Shapes -Reply
>
> Mr. Windsor:
> Post your fax number, so I may fax you a solderpaste
> aperture shape that I use for the complete elimination of
> solderballs for chip components.  It was proven it works
> better than home plate shape.
>
> regards
> Matthew Park
>
> >>> Clinton Windsor
> <[log in to unmask]> January
> 7, 1998  1:27 am >>>
> Dear Technetters,
>
> We are trying to eliminate the occurence of solder balls in
> our
> production line by trialling various aperture shapes and
> reductions on
> the screen printer stencil.  The nature of the solder balls
> suggests
> that paste is being trapped under the component and then
> forms a solder
> ball which adheres to the side of the component.  I have seen
> this type
> of solder ball referred to as a "squeeze ball".  We have tried
> the so
> called "home plate" (trapezoidal) shaped apertures with
> considerable
> success on nearly all the components except for the 0603
> capacitors.
>
> I would be interested to hear any ideas or suggestions of
> other aperture
> shapes or designs which could help solve this problem.
>
> Thanks in advance,
> Clinton Windsor
>
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