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Fri, 2 Jan 1998 09:10:04 EST |
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Hi Kelvin,
To my knowledge, there is no standard on pull testing leads or shear testing
chip components, nor should or could there be. First, the high variability in
pad/lead/component desig gives you too many variables; second, the pull/shear
strength per se does not give you an indication of the solder joint
reliability. Observation of the fracture surfaces can, however, give you
information whether or not your solder joints are properly wetted.
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]
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