Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 27 Jan 1998 15:23:03 -0600 |
Content-Type: | text/plain |
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MOST SMT COMPONENTS ARE PLASTIC PACKAGES .
I HAD EXPERIENCED REMOVAL OF COMPONENT MARKING ONCE THE
COMPONENTS ARE EXPOSED TO ACETONE AT 40-50 DEG C EVEN FOR SHORT
DURATIONS. ACETONE IS CORROSIVE EVEN TO SS.
IT MIGHT AFFECT RELIABILITY(CORROSION) AS PLASTIC PACKAGES MIGHT ABSORB
SOLVENT .
> ----------
> From: Chan, Marcelo[SMTP:[log in to unmask]]
> Sent: January 27, 1998 2:39 PM
> To: [log in to unmask]
> Subject: [TN] Acetone of SMT assemblies
>
> What are the drawbacks to using Acetone as a solvent on a fully
> assembled PWB with surface mount components? The idea is to dip the
> entire assembly for about 15 minutes....Would the epoxy molding on
> components absorb the acetone? What about the soldermask?
>
> Marcelo
>
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