Subject: | |
From: | |
Reply To: | TechNet Mail Forum. |
Date: | Wed, 7 Jan 1998 12:20:44 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Mitchell, James wrote:
>
> Hello!
>
> I am looking for guidance on choosing gold plating thicknesses and
> plating processes for circuit board edge fingers. For example: What are
> the recommendations for circuit board edge fingers that will be inserted
> into a connector and removed 10 times verses a installation/removal
> cycle of 50 times?
>
> Are there any references on the subject? Any help will be greatly
> appreciated!
>
No help from me, just more questions!
I recall from the 70's that there was once an alternate
underplate for longer life in the like of extender boards
or diagnostic plug-ins. I seem to recall specifying gold
over rhodium for lives of 100s of insertions.
Is this still done?
--
Jeff Seeger Applied CAD Knowledge Inc
Chief Technical Officer Tyngsboro, MA 01879
jseeger "at" appliedcad "dot" com 978 649 9800
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################
|
|
|