CAN YOU PROVIDE ME INFO ON THE BOOK.
> ----------
> From: Hamilton, Richard -4454[SMTP:[log in to unmask]]
> Sent: January 27, 1998 10:52 AM
> To: [log in to unmask]
> Subject: [TN] Steve McBride [TN] Design for Manufacturing
>
> Steve,
>
> I missed the original posting on this. We are in the same boat here,
> and
> would like to share experiences.
>
> Please forward your email address if you are interested.
>
> Thanks
>
> Richard Hamilton
> Clemar Mfg. / Rain Bird
> [log in to unmask]
>
> > -----Original Message-----
> > From: Stammely, Tim [SMTP:[log in to unmask]]
> > Sent: Monday, January 26, 1998 5:25 AM
> > To: [log in to unmask]
> > Subject: Re: [TN] Design for Manufacturing
> >
> > I found Ray Prasad's, "Surface Mount Technology--Principles and
> > Practice," to be a very helpful and update reference book.
> >
> > Regards,
> >
> > Tim Stammely
> > Manufacturing Engineer
> > Manufacturing Services & Integration (MSI)
> >
> > >-----Original Message-----
> > >From: [log in to unmask] [SMTP:[log in to unmask]]
> > >Sent: Friday, January 23, 1998 4:42 PM
> > >To: [log in to unmask]
> > >Subject: [TN] Design for Manufacturing
> > >
> > > All,
> > >
> > > We are a small engineering and manufacturing company just
> > getting into
> > > surface mount assembly. We have been almost exclusively
> through
> > hole
> > >but
> > > with the elimination of many through hole parts, we find it
> > necessary to
> > > move on. Additionally, most of our manufacturing contracts in
> > the past
> > > were older 'build to print' jobs based upon old designs for
> our
> > military
> > > customers.
> > > Soon, both manufacturing and engineering representatives will
> > meet to
> > > discuss manufacturing's design requirements. Because we have
> > had so
> > >little
> > > experience with surface mount assembly, we really don't know
> > what to ask
> > > for from a design for manufacturing standpoint.
> > > I would be interested in any design specifications or really
> any
> > reading
> > > material that could point us in the right direction (i.e. pad
> > geometry,
> > > component orientation, etc.) as well as manufacturing
> > > specifications/guidelines (i.e. stencil printing, solder
> reflow,
> > etc.).
> > >We
> > > are currently reviewing IPC-S-816, D-279, and SM-782.
> > >
> > > Thank you all in advance of your support.
> > >
> > > Steve McBride
> > > Manufacturing Engineer
> > > Frontier Electronic Systems Corp.
> > >
> > > (www.FEI-CORP.com)
> > >
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